AR/VR Headset Solutions

The requirements for AR/VR devices are "ultra-high-speed transmission, low latency, and lightweight". They need to support high-speed data transmission in 4K/8K video streams, in spatial positioning, and in eye-tracking, etc., within the limited internal space of the device, which puts extremely high requirements on the integration and anti-interference capabilities of connectors. This is also the core application scenario for next-generation consumer electronic connectors.

1、Camera：Micro board to board 4、Battery：Micro board to board Shrapnel
2、Antenna：Micro board to board Shrapnel 5、Memory&SIM：Card connector
3、Main and Sub Boards：Micro board to board 6、Type C：Type-C

Stories of Application Fields

New Trends in Miniature BTB Connectors

We’ll outline our perspective on industry trends, highlight several connector applications, and then draw a connection back to our own products.

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Application Trends of Battery Pack CCS

We’ll outline our perspective on industry trends, highlight several connector applications, and then draw a connection to our own products.

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Shenzhen Linkconn Electronics Co., Ltd.

Phone:86-755-82943323
Fax: 86-755-82966567
E-Mail:salescn@linkconn.com
Address: 15th Floor, Building E, China Resources Land Tower, High-Tech Park, Nanshan District, Shenzhen

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