Language

NEWS

Company News

Industry Information

Introduction to DIP, SMT, SMD packaging, and pin technology by USB socket connector manufacturers

Release time：

2021-11-09

USB socket connectors (male and female interfaces) are commonly used, including USB A-type socket DIP direct insertion, USB A-type socket SMT patch, USB B-type socket DIP direct insertion, USB Mini B-type socket patch... As a manufacturer of USB socket connectors, here is a detailed introduction to the concept definition of common USB sealing technologies: DIP, SMT, SMD

1、 Introduction to DIP packaging technology for USB sockets!

DIP packaging, also known as dual inline packaging technology, is the abbreviation for dual inline package. Refers to integrated circuit chips packaged in a dual inline format, which is used by the vast majority of small and medium-sized integrated circuits.

The advantages of DIP packaging: suitable for punching and welding on PCB (printed circuit board), easy to operate, and good compatibility with the motherboard.

Defect of DIP packaging: Due to its large packaging area and thickness, and the fact that pins are easily damaged during insertion and extraction, its reliability is poor.

2、 Introduction to SMT packaging technology for USB sockets!

SMT is Surface Mount Technology, which is currently a popular electronic component assembly process.

3、 Introduction to SMD Packaging Technology for USB Sockets

SMD Surface Mounted Devices

Shenzhen Linkconn Electronics Co., Ltd.

Tel：86-755-82943323
Fax：86-755-82966567
E-Mail：szlcn@linkconn.com
Add：15/F, Block E, China Resources Land Building, Hi-Tech Park, Nanshan District, Shenzhen, China